Connector Blocks

This document provides technical specifications, dimensional drawings, and contact replacement information for the H800-W and H800-F 8-module molded socket assemblies used in FLIP CHIP mounting panels. It includes detailed diagrams showing wire-wrap total length, solder-fork total length, and module-side clearance dimensions. Additionally, it specifies that replacement contacts are available in packages of 18 (nine straight and nine offset) under part numbers H801-W for wire-wrap and H801-F for solder-fork connectors.