G613 X Diode Matrix

This document describes the G613 module, a hardware component consisting of 256 diodes arranged to form an 8 x 8 two-way crosspoint switching matrix, providing 64 pairs of interconnecting points. It notes that this module connects 64 cores from each of 18 memory planes to create current paths for the X-axis in a core memory stack. Additionally, it highlights the inclusion of a thermistor for controlling read and write currents based on temperature fluctuations. The document references Engineering Drawings D-BS-MM15-0-6 and D-BS-MM15-0-7 for further technical detail.